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Hot-press
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Detecting device and method for electronic product
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Metal electroplating method of integrated circuit packaging substrate
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Wire clamp used in integrated circuit
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Conducting wire tester of integrated circuits
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Pressing device of base board or wire frame for semiconductor package
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High radiation miniature package for semiconductor chip
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Open type multi-chip stacking package unit
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Nailing rack structure of integrated circuit
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Heat radiation plate with embeded tip and package thereof
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Wafer package assembling with film substrate
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Wafer formation metal convex block package structure and making method thereof
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Package structure of CCD pick-up chip
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Integrated circuit baseplate column-like projection block forming method
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Semiconductor baseplate carrier and its production method
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Method for packing miniature semiconductor chip
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Process for preparing thin EBGA substrate
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Method for combining overlay transistor part with wafer
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