Learn more

HUATAI ELECTRONIC CO LTD

Overview
  • Total Patents
    20
About

HUATAI ELECTRONIC CO LTD has a total of 20 patent applications. Its first patent ever was published in 2000. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are APPLIED MICROENGINEERING LTD, MEGAMOS CORP and ONABEDA SHINJI.

Patent filings in countries

World map showing HUATAI ELECTRONIC CO LTDs patent filings in countries
# Country Total Patents
#1 China 20

Patent filings per year

Chart showing HUATAI ELECTRONIC CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Xie Wenle 14
#2 Huang Ning 7
#3 Zhuang Yongcheng 5
#4 Huang Fuyu 3
#5 Yang Chuncai 2
#6 Cai Minlang 2
#7 Su Zhenping 2
#8 Yang Jiaming 2
#9 Jin Hong 2
#10 Huang Yuchun 1

Latest patents

Publication Filing date Title
CN1915645A Hot-press
CN1715942A Detecting device and method for electronic product
CN1549337A Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts
CN1494120A Metal electroplating method of integrated circuit packaging substrate
CN1494121A Wire clamp used in integrated circuit
CN1490863A Conducting wire tester of integrated circuits
CN1484289A Pressing device of base board or wire frame for semiconductor package
CN1484302A High radiation miniature package for semiconductor chip
CN1484308A Open type multi-chip stacking package unit
CN1457091A Nailing rack structure of integrated circuit
CN1420557A Heat radiation plate with embeded tip and package thereof
CN1372314A Wafer package assembling with film substrate
CN1372312A Wafer formation metal convex block package structure and making method thereof
CN1347151A Package structure of CCD pick-up chip
CN1342038A Integrated circuit baseplate column-like projection block forming method
CN1341959A Semiconductor baseplate carrier and its production method
CN1340852A Technology for making printed convex block on semiconductor carrier
CN1338773A Method for packing miniature semiconductor chip
CN1338891A Process for preparing thin EBGA substrate
CN1313631A Method for combining overlay transistor part with wafer