Learn more

SHIU HUEI-CHIUN

Overview
  • Total Patents
    28
About

SHIU HUEI-CHIUN has a total of 28 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Taiwan. Its main competitors in its focus markets thermal processes, machines and semiconductors are PAI HAO, HSU HUL-CHUN and YANG HSIU-WEI.

Patent filings in countries

World map showing SHIU HUEI-CHIUNs patent filings in countries
# Country Total Patents
#1 Taiwan 28

Patent filings per year

Chart showing SHIU HUEI-CHIUNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shiu Huei-Chiun 28

Latest patents

Publication Filing date Title
TW200628747A Heat pipe enclosing method and enclosure structure without pipe shrinkage process
TW200628750A An off-center rotary welding method and device for a heat pipe
TWI247643B Welding method and its device for heat tubes for continuous transmission in parallel
TW200624750A Forming method of heat pipe with continuous juxtaposed conveyance and apparatus thereof
TWI244420B A horizontal rotation end-sealing method for heat tube
TW200624756A The degassing sealing method and device with the heat pipes that are transported continuously and side-by-side
TWI248839B Degassing and sealing method and its device for continuous transmission of heat pipes
TW200624210A Method and device for welding heat pipe in such a way that heat pipe is conveyed successively
TW200535391A Method for forming end face of heat pipe and its structure
TW200504324A Method and apparatus for removing non-condensable vapor within heat pipe
TW200409897A Method and device for removing non-condensing gas in a heat pipe
TW200409896A Method for installing heat pipe capillary and device therefor
TW589444B Heat tube forming structure
TW539825B Heat receiving structure on end of heat pipe
TWI227175B Plate type heat tube capable of bending and resisting high pressure stress
TWI235818B Method for filling in gap between thermal conduction members and structure thereof
TW552841B Lamination structure to increase the heat dissipation area and heat diffusion, and the manufacturing method thereof
TW591197B Thermally conductive interfacial layer
TW595306B Removable high density heat dissipation fin assembly and heat dissipation device
TW580555B Heat pipe structure that receives heat at ends