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HIGH CONNECTOR DENSITY INC

Overview
  • Total Patents
    12
About

HIGH CONNECTOR DENSITY INC has a total of 12 patent applications. Its first patent ever was published in 2001. It filed its patents most often in Taiwan. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and machines are WELLS ELECTRONICS, HIGH CONNECTION DENSITY INC and YAMAICHI ELECTRIC CO LTD.

Patent filings in countries

World map showing HIGH CONNECTOR DENSITY INCs patent filings in countries
# Country Total Patents
#1 Taiwan 12

Patent filings per year

Chart showing HIGH CONNECTOR DENSITY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Che-Yu 11
#2 Fan Zhineng 10
#3 Le Ai D 6
#4 Moriarty Sharon L 2
#5 Brown Dirk D 2
#6 Van Linh 1
#7 Williams John D 1
#8 Klisch John A 1
#9 Lahlouh John G S 1
#10 Willians John D 1

Latest patents

Publication Filing date Title
TW558807B Low profile, high density memory system
TW577187B Interposer and method thereof for use in electronic packages
TW569501B A shielded carrier for land grid array connectors
TW525184B Stackable modules with clustered connections