HIGH CONNECTOR DENSITY INC has a total of 12 patent applications. Its first patent ever was published in 2001. It filed its patents most often in Taiwan. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and machines are WELLS ELECTRONICS, HIGH CONNECTION DENSITY INC and YAMAICHI ELECTRIC CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 12 |
# | Industry | |
---|---|---|
#1 | Electrical machinery and energy | |
#2 | Audio-visual technology | |
#3 | Machines | |
#4 | Semiconductors | |
#5 | Measurement | |
#6 | Computer technology | |
#7 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Li Che-Yu | 11 |
#2 | Fan Zhineng | 10 |
#3 | Le Ai D | 6 |
#4 | Moriarty Sharon L | 2 |
#5 | Brown Dirk D | 2 |
#6 | Van Linh | 1 |
#7 | Williams John D | 1 |
#8 | Klisch John A | 1 |
#9 | Lahlouh John G S | 1 |
#10 | Willians John D | 1 |
Publication | Filing date | Title |
---|---|---|
TW558807B | Low profile, high density memory system | |
TW577187B | Interposer and method thereof for use in electronic packages | |
TW569501B | A shielded carrier for land grid array connectors | |
TW525184B | Stackable modules with clustered connections |