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HIGH CONNECTION DENSITY INC

Overview
  • Total Patents
    68
About

HIGH CONNECTION DENSITY INC has a total of 68 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and computer technology are YAMAICHI ELECTRIC CO LTD, HIGH CONNECTOR DENSITY INC and MEDCONX INC.

Patent filings in countries

World map showing HIGH CONNECTION DENSITY INCs patent filings in countries

Patent filings per year

Chart showing HIGH CONNECTION DENSITY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Che-Yu 44
#2 Fan Zhineng 31
#3 Le Ai D 19
#4 Brown Dirk D 11
#5 Sly Thomas L 9
#6 Shi Weimin 8
#7 Korhonen Matti A 5
#8 Moriarty Sharon L 5
#9 Zhineng Fan 4
#10 Van Linh 3

Latest patents

Publication Filing date Title
US6846184B2 Low inductance electrical contacts and LGA connector system
US6705877B1 Stackable memory module with variable bandwidth
US6712620B1 Coaxial elastomeric connector system
US6597062B1 Short channel, memory module with stacked printed circuit boards
US6545895B1 High capacity SDRAM memory module with stacked printed circuit boards
US6551112B1 Test and burn-in connector
US6661690B2 High capacity memory module with built-in performance enhancing features
CN1460312A Demountable clamping for land grid array connectors
US6663399B2 Surface mount attachable land grid array connector and method of forming same
US6712621B2 Thermally enhanced interposer and method
US6540525B1 High I/O stacked modules for integrated circuits
CN1388973A Low profile, high density memory system
US6742426B2 Precision cutter for elastomeric cable
US6723927B1 High-reliability interposer for low cost and high reliability applications
US6381164B1 Low profile, high density memory system
US6546625B1 Method of forming a contact member cable
US6638077B1 Shielded carrier with components for land grid array connectors
US6590159B2 Compact stacked electronic package
US6439894B1 Contact assembly for land grid array interposer or electrical connector
US6471525B1 Shielded carrier for land grid array connectors and a process for fabricating same