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HELIX TECHNOLOGY INC

Overview
  • Total Patents
    55
About

HELIX TECHNOLOGY INC has a total of 55 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Taiwan, United States and Japan. Its main competitors in its focus markets semiconductors, surface technology and coating and electrical machinery and energy are THERMTECS CO LTD, BOBOO HI TECH CO LTD and LUMIOTEC INC.

Patent filings in countries

World map showing HELIX TECHNOLOGY INCs patent filings in countries
# Country Total Patents
#1 Taiwan 27
#2 United States 14
#3 Japan 9
#4 Republic of Korea 3
#5 Germany 2

Patent filings per year

Chart showing HELIX TECHNOLOGY INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Peng Kuang-Chung 14
#2 Wu Cheng-Tao 8
#3 Peng Guang-Jung 6
#4 Lo Shih-Lun 5
#5 Suen Shr-Yau 4
#6 Yeh Ya-Hui 4
#7 Wu Chin-Min 3
#8 Chen Lee-Cheng 3
#9 Liao Hao-Yi 3
#10 Sun Shih-Yao 3

Latest patents

Publication Filing date Title
TW200640537A Mask having bacteriostatic effect
TW200641162A Nanometer material preparation and fabricating method thereof
TW200535507A Liquid crystal module of LCD
TW200530416A Method and device for sputtering fabric
US2005042959A1 Anti-static fabric
US2005042960A1 Electromagnetic radiation shielding fabric
TW200513137A Electro-thermal film
TW200513135A Method of fabricating electro-thermal film
TW200512808A Method of manufacturing electrothermal film
TW593833B Method for plating a film to a non-ionized radiation fibrous fabric
TW200506458A Straight-down backlight module
TW200425171A Transparent conductive film plate with low resistance
US2003122099A1 Valve assembly
US7078070B2 Method for fabricating an organic light emitting diode
US6641674B2 Movable evaporation device
TW557495B Method and device for producing polycrystalline indium tin oxide (ITO) film in a low temperature process
US6705739B2 Backlighting module for a display apparatus
JP2003109726A Electric heating film
TW515017B Manufacturing method of under bump metallurgy and its equipment
TW507335B Bump balling process