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WILLIAMS RICHARD K

Overview
  • Total Patents
    35
  • GoodIP Patent Rank
    210,316
  • Filing trend
    ⇩ 100.0%
About

WILLIAMS RICHARD K has a total of 35 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2000. It filed its patents most often in United States, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are SUN RUNGUANG, OKUMOTO KENJI and WIRTH RALPH.

Patent filings in countries

World map showing WILLIAMS RICHARD Ks patent filings in countries

Patent filings per year

Chart showing WILLIAMS RICHARD Ks patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Williams Richard K 35
#2 Brown David A 9
#3 D Angelo Kevin 9
#4 Chan Wai Tien 5
#5 Disney Donald Ray 5
#6 Grabowski Wayne 4
#7 Hariman George A 4
#8 Choi Alexander K 3
#9 Lam Allen K 3
#10 Grabowski Wayne B 2

Latest patents

Publication Filing date Title
US2014257833A1 Cloud Based System For Remote Medical Checkup And Physician Managed Biometric Data
US2014128941A1 Phototherapy system and process including dynamic LED driver with programmable waveform
US2014306330A1 Low profile leaded semiconductor package
US2013099702A1 Low cost LED driver with improved serial bus
US2013147370A1 Serial lighting interface with embedded feedback
US2013082614A1 Low cost LED driver with integral dimming capability
US2013043595A1 Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance
US2013043574A1 Multi-die semiconductor package with one or more embedded die pads
US2013043572A1 Integrated circuit die with low thermal resistance
US2008237656A1 Isolated junction field-effect transistor
US2008252372A1 Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof
US2009039947A1 Time-multiplexed-capacitor DC/DC converter with multiple outputs
WO0074448A1 Surface mount package for power semiconductor devices