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HCT SHAPING SYSTEMS SA

Overview
  • Total Patents
    62
About

HCT SHAPING SYSTEMS SA has a total of 62 patent applications. Its first patent ever was published in 1989. It filed its patents most often in Switzerland, EPO (European Patent Office) and United States. Its main competitors in its focus markets machines, machine tools and packaging and shipping are APPLIED MATERIALS SWITZERLAND SA, BRIAR HILL STONE COMPANY and ELECTROLUX PROFESSIONAL OUTDOOR PRODUCTS INC.

Patent filings per year

Chart showing HCT SHAPING SYSTEMS SAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hauser Charles 49
#2 Muller Andreas 8
#3 Bortnikov Alexander 7
#4 Foretay Alain 3
#5 Rosset Jean-Marc 2
#6 Mueller Andreas 2
#7 Nasch Philippe 1

Latest patents

Publication Filing date Title
JP2007007848A Method of detection of malfunction in wire saw and device for executing the method
EP1685934A1 Wire sawing device and process
EP1555101A1 Wire saw device
EP1437209A1 Wire sawing device
CH697022A5 Wire coil for use in wire sawing device, has ring separated from other ring when parts of coil are separated for permitting removal of wire from coil, where parts which are removable from each other follow central axis
CH696757A5 Process and wire sawing device.
CH696431A5 Process and wire sawing device.
CH694182A5 Wire sawing device.
CH697024A5 Wire sawing device.
CH692485A5 Wire sawing device.
US6371101B1 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers
CH692489A5 Wire sawing device for cutting prisms comprises two parallel wire layers forming mesh network which is displaced against part to be sawn fixed on support table
CH692138A5 Cutting machine for producing thin slices of hard materials has treatment/recycling unit for slip containing abrasive and sawn particles
CH692329A5 Wire saw has successive wire guide cylinders to define multiple wire cross points for cutting work
CH691117A5 Wire saw for fine cutting has cutting cylinder with profile shaped to cause radial movement of wires
CH691039A5 Abrasive fluid, e.g. for wire sawing, multiblade sawing or lapping operations, comprises solid abrasive particles suspended in a mixture of water-soluble polyol compounds, at least one of which is a polyglycol
CH691798A5 Cutting center for producing slices from slicing pieces.
CH690907A5 Wire sawing device
CH691045A5 A method for the orientation of several crystalline parts placed side by side on a cutting support for a simultaneous cutting in a cutting machine and device for
CH691169A5 Device for storage element slices obtained by cutting a block.