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APPLIED MATERIALS SWITZERLAND SARL

Overview
  • Total Patents
    43
  • GoodIP Patent Rank
    172,184
About

APPLIED MATERIALS SWITZERLAND SARL has a total of 43 patent applications. Its first patent ever was published in 2009. It filed its patents most often in China, EPO (European Patent Office) and Japan. Its main competitors in its focus markets machine tools, machines and semiconductors are CONCRETE KOORING KK, BENETTI MACCHINE and GREGORI SPA.

Patent filings in countries

World map showing APPLIED MATERIALS SWITZERLAND SARLs patent filings in countries

Patent filings per year

Chart showing APPLIED MATERIALS SWITZERLAND SARLs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schmid Andreas 12
#2 Nasch Philippe 10
#3 Genonceau Franck 6
#4 Mittaz Alexandre 5
#5 Mercay Guillaume 5
#6 El Haddaoui Najib 4
#7 Zominy Claude 4
#8 Beau De Lomenie Romain 3
#9 Fay Richard 3
#10 Manens Antoine 3

Latest patents

Publication Filing date Title
CN105216131A Chip cleaning system, silk saw and the method for the wafer in clean silk saw
CN105321859A Processing apparatus for processing a semiconductor ingot, and carrier and method of transferring and processing a semiconductor ingot
CN104999575A Motor unit for a wire saw device and wire saw device employing the same
CN105020369A Pulley for wire saw device, wire saw device, and applications of pulley for wire saw device
CN105014804A Wire guide monitoring device, wire saw, and method for monitoring a wire guide
CN105014803A Quick mountable pulley for wire saw device, the wire saw device, and appliacaiton of the pulley
CN104290205A Wire saw device and method of manufacturing thereof
CN104552627A Semiconductor wire saw including a nozzle for generating a fluid jet
CN104227856A Wire monitoring system for a wire saw and method for monitoring a wire saw
CN103978311A Wire guide and a method for forming a wire guide
CN103963182A Device Used For Cleaning Line Of Fretsaw
EP2583777A1 Clamping assembly for a wire guide of a wire saw
EP2647458A1 Wire for semiconductor wire saw and wire saw
EP2628558A1 Diamond wire saw device and method
EP2586583A1 Wire saw control system and wire saw
EP2586555A1 Modular wafering concept for wafering plant
EP2586554A1 Wire saw device with two independent wire webs and method thereof
EP2586557A1 Saw and sawing element with diamond coating and method for producing the same
EP2583778A1 Method and apparatus for measuring wire-web bow in a wire saw
WO2013041140A1 Method and apparatus for cutting semiconductor workpieces