| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 11 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Australia | 1 | |
| #4 | China | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Machine tools | |
| #3 | Semiconductors | |
| #4 | Packaging and shipping |
| # | Technology | |
|---|---|---|
| #1 | Working stone | |
| #2 | Sawing | |
| #3 | Unspecified technologies | |
| #4 | Handling thin material | |
| #5 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Nasch Philippe | 6 |
| #2 | Bucher Niklaus Johann | 6 |
| #3 | Baranes David | 6 |
| #4 | Schmid Andreas | 5 |
| #5 | Mercay Guillaume | 4 |
| #6 | Mittaz Alexandre | 3 |
| #7 | Sebastien Soubielle | 3 |
| #8 | John Speyrer | 2 |
| #9 | Rosset Jean-Marc | 2 |
| #10 | Speyrer John | 2 |
| Publication | Filing date | Title |
|---|---|---|
| JP2016000454A | Ingot sawing method and system | |
| EP2586556A1 | Quick exchange squarer wire-guides without alignment | |
| EP2111960A1 | Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device |