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Multi-TSV millimeter wave vertical interconnection structure with spiral strip lines connected in series
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Three-dimensional heterogeneous integrated comprehensive radio frequency front end micro-system
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Coordination method for chip cutting errors in embedded micro-system module
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Mixed base through hole micro-coaxial structure for vertical interconnection of radio frequency microsystems and manufacturing method thereof
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Multichannel TR subassembly test system based on ARM treater
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three-dimensional stacking radio frequency optical module manufacturing method
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three-dimensional radio frequency module manufacturing method based on multilayer heat dissipation structure
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manufacturing method of three-dimensional stacked heat dissipation module aiming at radio frequency chip heat concentration points
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flexible circuit board radio frequency module with heat dissipation function and manufacturing method thereof
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A kind of radio-frequency structure and preparation method thereof that multilayer chiop stacks
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A kind of liquid-cooling heat radiation interconnection architecture of high-power system grade radio-frequency module and preparation method thereof
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It is a kind of to erect the liquid-cooling heat radiation radio-frequency structure and preparation method thereof placed
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Liquid-cooling heat radiation structure and preparation method thereof is placed in a kind of setting of high-power RF chip
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