| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 12 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines | |
| #4 | Machine tools | |
| #5 | Materials and metallurgy | |
| #6 | Telecommunications | |
| #7 | Computer technology | |
| #8 | Optics |
| # | Name | Total Patents |
|---|---|---|
| #1 | Sakurai Daisuke | 12 |
| #2 | Yagi Yoshihiko | 5 |
| #3 | Usirokawa Kazuya | 2 |
| #4 | Yoshino Michiro | 1 |
| #5 | Hagihara Kiyomi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2009315178A1 | Conductive bump, method for producing the same, and electronic component mounted structure | |
| US2009039168A1 | Noncontact information storage medium and method for manufacturing same |