GEORGE GREGORY has a total of 17 patent applications. Its first patent ever was published in 1913. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets semiconductors, machines and surface technology and coating are EV GROUP GMBH, SATO Y and VANTEC CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 11 | |
#2 | WIPO (World Intellectual Property Organization) | 3 | |
#3 | Australia | 2 | |
#4 | China | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Surface technology and coating | |
#4 | Foods and drinks | |
#5 | Materials and metallurgy | |
#6 | Machine tools | |
#7 | Consumer goods |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Unspecified technologies | |
#3 | Layered products | |
#4 | Unspecified technologies | |
#5 | Soldering, welding and flame cutting | |
#6 | Writing or drawing tools | |
#7 | Casting metal | |
#8 | Foods |
# | Name | Total Patents |
---|---|---|
#1 | George Gregory | 13 |
#2 | Johnson Hale | 3 |
#3 | Hermanowski James | 2 |
#4 | Lutter Stefan | 2 |
#5 | Gorun Patrick | 2 |
#6 | Gregory George | 2 |
#7 | Stiles Matthew | 2 |
#8 | Singh Hakam | 2 |
#9 | Wright Seth | 1 |
#10 | Ziegler James | 1 |
Publication | Filing date | Title |
---|---|---|
US2013244400A1 | Method and apparatus for temporary bonding of ultra thin wafers | |
US2011290415A1 | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers | |
US2011253315A1 | Debonding equipment and methods for debonding temporary bonded wafers | |
US2012080146A1 | Apparatus for high throughput wafer bonding | |
US2010122762A1 | Method and apparatus for wafer bonding with enhanced wafer mating | |
US2009251699A1 | Apparatus and method for semiconductor wafer alignment | |
AU2004325245A1 | System and method for termination of a wire rope | |
CN1141582A | Palatable low salt substitutes | |
US1144426A | Pencil-securing holder. |