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EV GROUP GMBH

Overview
  • Total Patents
    158
  • GoodIP Patent Rank
    96,507
  • Filing trend
    0.0%
About

EV GROUP GMBH has a total of 158 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2009. It filed its patents most often in EPO (European Patent Office), China and Republic of Korea. Its main competitors in its focus markets machines, semiconductors and surface technology and coating are GEORGE GREGORY, ZHEJIANG MICROTECH MAT CO LTD and SATO Y.

Patent filings per year

Chart showing EV GROUP GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lindner Friedrich Paul 41
#2 Wimplinger Markus 36
#3 Thallner Erich 33
#4 Kast Michael 26
#5 Lindner Paul 23
#6 Burggraf Juergen 20
#7 Burggraf Jurgen 15
#8 Pargfrieder Stefan 12
#9 Burgstaller Daniel 12
#10 Tiefenboeck Herbert 10

Latest patents

Publication Filing date Title
DE102010055288A1 Device for machining a workpiece
CN103189172A Method and device for producing a lens wafer
CN103155097A Device for coating a wafer
DE102010048043A1 Apparatus and method for processing wafers
KR20130085412A Stamping tool, device and method for producing a lens wafer
DE102010035150A1 Automatically coupled chuck
KR20130132732A Handling device for handling a wafer
EP2383771A1 Method and device for loosening a polymer coating from a surface of a substrate
EP2381464A1 Device and method for releasing a product substrate from a holder substrate
EP2553503A1 Method and device for producing a micro-lens
TW201445660A Device and method for stripping a wafer from a carrier
TW201133676A Device and method for stripping a wafer from a carrier
TW201324664A Device and method for stripping a wafer from a carrier
EP2667407A2 Method for releasing a product substrate (e.g., a semiconductor wafer) from a support substrate using a solvent and acoustic waves by deformation of a flexible film mounted on a frame
DE102009018977A1 Device for aligning and prefixing a wafer
DE102009018434A1 Recording device for receiving semiconductor substrates
DE102009018156A1 Apparatus and method for separating a substrate from a carrier substrate
EP2230683A1 Device and method for releasing a wafer from a holder