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FURUKAWA TECHNO RES KK

Overview
  • Total Patents
    34
About

FURUKAWA TECHNO RES KK has a total of 34 patent applications. Its first patent ever was published in 2001. It filed its patents most often in Japan. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are CIRCUIT FOIL SA, YATES FOIL USA INC and NIKKO GOULD FOIL KK.

Patent filings in countries

World map showing FURUKAWA TECHNO RES KKs patent filings in countries
# Country Total Patents
#1 Japan 34

Patent filings per year

Chart showing FURUKAWA TECHNO RES KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Matsuda Akira 6
#2 Suzuki Yuji 6
#3 Suzuki Akitoshi 4
#4 Shinozaki Kensaku 4
#5 Otsuka Hideo 4
#6 Nakaoka Tadao 4
#7 Ashizawa Koichi 3
#8 Ikeda Takeshi 3
#9 Kimijima Hisao 3
#10 Wasamoto Mitsuyuki 3

Latest patents

Publication Filing date Title
JP2004263300A Copper foil for fine pattern printed circuit and manufacturing method therefor
JP2004256910A Copper foil for high-frequency circuit, manufacturing method therefor, manufacturing facility therefor, and high-frequency circuit using the copper foil
JP2004263296A Copper foil for fine pattern printed circuit and manufacturing method therefor
JP2004169181A Ultrathin copper foil with carrier and method for manufacturing the same, and printed wiring board using ultrathin copper foil with carrier
JP2004119961A Copper foil for chip-on film, plasma display panel, and high-frequency printed wiring board
JP2004079523A Electrolytic copper foil and electrolytic copper foil for current collector of secondary battery
JP2004315843A Electrically conductive base material with resistance layer, circuit board with resistance layer, and resistance circuit wiring board
JP2004260068A Copper foil for shielding electromagnetic wave, and electromagnetic wave shielding structure
JP2004244710A Copper foil for chip on film
JP2004244656A Copper foil which can deal with high-frequency application and method for manufacturing the same
JP2004238647A Smoothened copper foil, and production method therefor
JP2006155899A Copper alloy composite foil, its manufacturing method and ultrahigh frequency transmission circuit using the copper alloy composite foil
JP2006150591A Metal foil for high frequency circuit
JP2004237294A Copper foil for laser boring
JP2004176101A Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer and circuit board material with resistance layer
JP2004148575A Copper foil composite sheet for printed wiring board and method for manufacturing printed wiring board
JP2004127954A Copper foil composite material for printed wiring board
JP2006078179A Micro-mass sensor and holding mechanism of its oscillator
JP2004031802A Copper foil composite article for printed wiring board
JP2003332824A Radiating element for antenna device and its manufacturing method