CIRCUIT FOIL USA INC has a total of 16 patent applications. Its first patent ever was published in 1991. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are CIRCUIT FOIL LUXEMBOURG SARL, NIKKO GOULD FOIL KK and YATES FOIL USA INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 6 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | Australia | 1 | |
#5 | China | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Surface technology and coating | |
#3 | Machines |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Electrolytic coating production | |
#3 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Yates Charles B | 10 |
#2 | Wolski Adam M | 8 |
#3 | Dufresne Paul | 8 |
#4 | Wolski Adam | 7 |
#5 | Cheng Chinsai T | 7 |
#6 | Gaskill George | 7 |
#7 | Bodendorf Keith | 7 |
#8 | Cheng Chintsai T | 3 |
#9 | Mathieu Michel | 3 |
#10 | Maquet Laure M | 2 |
Publication | Filing date | Title |
---|---|---|
US5989727A | Electrolytic copper foil having a modified shiny side | |
US6270645B1 | Simplified process for production of roughened copper foil | |
US5863410A | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby | |
US5447619A | Copper foil for the manufacture of printed circuit boards and method of producing the same | |
US5215646A | Low profile copper foil and process and apparatus for making bondable metal foils | |
US5207889A | Method of producing treated copper foil, products thereof and electrolyte useful in such method |