| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Germany | 4 | |
| #2 | EPO (European Patent Office) | 2 | |
| #3 | United States | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 | |
| #5 | China | 1 | |
| #6 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Control | |
| #3 | Machine tools | |
| #4 | Measurement |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Control or regulating systems | |
| #3 | Soldering, welding and flame cutting | |
| #4 | Analysing materials |
| # | Name | Total Patents |
|---|---|---|
| #1 | Winkler Matthias | 10 |
| #2 | Koch Michael | 9 |
| #3 | Monno Bernd | 2 |
| #4 | Bahn Andreas | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102013207599A1 | Placement device and placement method for accurately aligning and / or equipping a substrate with a component | |
| DE102013207598A1 | Placement device and placement method | |
| DE102012204336A1 | Device for positioning a component on a substrate | |
| DE19903957A1 | Method and apparatus for removing solder |