SEIL ELECTRONICS CO LTD has a total of 11 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Republic of Korea and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, semiconductors and machine tools are KOREA CIRCUIT CO LTD, HONGQISHENG PRECISION ELECTRONICS QINHUANGDAO CO LTD and MULTILAYER PCB TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 9 | |
#2 | WIPO (World Intellectual Property Organization) | 2 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Semiconductors | |
#3 | Machine tools |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Soldering, welding and flame cutting | |
#3 | Semiconductor devices |
# | Name | Total Patents |
---|---|---|
#1 | Ahn Jae Hwa | 6 |
#2 | Park Gookhyun | 2 |
#3 | Kim Seong Min | 2 |
#4 | Kim Suhyung | 2 |
#5 | So Tae Yun | 2 |
#6 | Ahn Jaehwa | 2 |
#7 | Yoon Sang Hwan | 1 |
#8 | Youn Sang Seop | 1 |
#9 | Lee Hyeon Woo | 1 |
#10 | Lee Hi Kyoung | 1 |
Publication | Filing date | Title |
---|---|---|
KR101944756B1 | Substrate for electronic component | |
KR101944755B1 | Electronic component substrate | |
KR20160144189A | Bendable flexible metal copper clad laminate printed circuit board and method for manufacturing the same | |
KR101391938B1 | Making method of metal core pcb by hole punching and metal core pcb thereby | |
KR20140054476A | Adhesive apparatus of pcb using ld flex adhesive ink and adhesive method | |
WO2008072845A1 | Heat sink and method of manufacturing the same | |
KR20080114052A | Open-area making process of multi-layer printed circuit board using laser-cutting | |
KR20040009361A | Bandable printed circuit board and the manufacturing method | |
KR20020006614A | Fabrication method of high reliability printed circuit board | |
KR100275667B1 | Power supply for arc welding using partial resonant soft switching |