| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 3 | |
| #2 | Philippines | 3 | |
| #3 | Singapore | 3 | |
| #4 | United States | 3 | |
| #5 | Malaysia | 1 | |
| #6 | Taiwan | 1 | |
| #7 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Measurement | |
| #3 | Audio-visual technology | |
| #4 | Packaging and shipping |
| # | Technology | |
|---|---|---|
| #1 | Measuring electric variables | |
| #2 | Semiconductor devices | |
| #3 | Casings and printed circuits | |
| #4 | Transport or storage devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lee Heng Lee | 12 |
| #2 | Lee Lee Heng | 2 |
| #3 | Lee Heng-Lee | 1 |
| Publication | Filing date | Title |
|---|---|---|
| SG10201504677WA | Device and method for conveying and flipping a component | |
| PH12014000159A1 | An appratus for picking, placing and pressing semiconductor components | |
| SG10201403076SA | An apparatus for picking, placing and pressing semiconductor components | |
| WO2013176537A1 | A semiconductor components delivery system associated with a turret type testing apparatus | |
| MY168113A | An apparatus for picking, placing and pressing semiconductor components |