WECON AUTOMATION CORP has a total of 17 patent applications. Its first patent ever was published in 2009. It filed its patents most often in China, Taiwan and Japan. Its main competitors in its focus markets semiconductors, machine tools and optics are ADVANCED LASER SEPARATION INTE, KOBO PDA CO LTD and J P SERCEL ASSOCIATES INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 5 | |
#2 | Taiwan | 5 | |
#3 | Japan | 4 | |
#4 | United States | 3 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools | |
#3 | Optics |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Soldering, welding and flame cutting | |
#3 | Optical systems |
# | Name | Total Patents |
---|---|---|
#1 | Wu Chao Ching | 4 |
#2 | Chang Ching Tsung | 3 |
#3 | Du Zhao-Ying | 2 |
#4 | Zheng Ruihuai | 2 |
#5 | Lu Yen-Hao | 2 |
#6 | Wu Chaoqing | 2 |
#7 | Lai Bo-Yan | 2 |
#8 | Zhong Ren-Hou | 2 |
#9 | Chen Guang-Cheng | 2 |
#10 | Lu Yen Hao | 2 |
Publication | Filing date | Title |
---|---|---|
JP2014135426A | Die arrangement method | |
CN103794517A | Circular type crystal grain placement method | |
TW201417195A | Circular type die placing method | |
TW201330075A | Cutting device and method | |
CN102479885A | Method for manufacturing semiconductor element | |
TW201218414A | Manufacturing method of semiconductor element | |
JP2011176005A | Chip sorting method by leading chip | |
CN101996915A | Driving device and die bonder | |
TW201103099A | Driving apparatus and die bonder thereof | |
CN101837333A | Glue-dispensing needle head structure | |
TW201031469A | Dispensing needle structure and dispensing apparatus thereof |