| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 4 | |
| #2 | Taiwan | 4 | |
| #3 | United States | 4 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Packaging and shipping |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Manipulators |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lee Tien-Chun | 3 |
| #2 | Wu Hsiao-Chia | 2 |
| #3 | Wu Hsiao Chia | 2 |
| #4 | Tien Chi-Hung | 2 |
| #5 | Feng Jain-Yuan | 2 |
| #6 | Lee Tien Chun | 1 |
| #7 | Chen Meng-Hung | 1 |
| #8 | Chen Meng Hung | 1 |
| #9 | Hsiao Ching Fang | 1 |
| #10 | Hsu Hsiu-Wen | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201743398A | Carrier device and wafer processing carrier | |
| US2016351428A1 | Wafer transport device | |
| US2016343603A1 | Wafer transport device | |
| TWI562378B | Semiconductor device | |
| TW201622150A | Semiconductor device, termination structure and method of forming the same | |
| TW200638541A | Method for fabricating trench power MOSFET |