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OITA NIPPON DENKI KK

Overview
  • Total Patents
    20
About

OITA NIPPON DENKI KK has a total of 20 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors are KONG MING, BEIJING YANDONG MICROELECTRONIC CO LTD and SHIMIZU HIROJI.

Patent filings in countries

World map showing OITA NIPPON DENKI KKs patent filings in countries
# Country Total Patents
#1 Japan 20

Patent filings per year

Chart showing OITA NIPPON DENKI KKs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Ibe Masahiro 4
#2 Yaake Toshichika 4
#3 Ikura Jiyunji 3
#4 Tanaka Yoshiyuki 3
#5 Hatasako Manabu 1
#6 Nomura Tadashi 1
#7 Ikura Junji 1
#8 Miyagaki Tetsuya 1
#9 Isomura Yuichi 1
#10 Inoue Yoshiro 1

Latest patents

Publication Filing date Title
JP2001156234A Manufacturing methods of lead plating machine and semiconductor device
JP2001144239A Lead-cutting die
JP2001062524A Device and method of lead cutting
JP2001030180A L-shaped hexagonal wrench having driving hole, setting of it, and using method of it
JP2001024026A Retainer jig for wire bonding
JP2001004696A Handling device with lead detecting function and its lead detecting method
JP2000323529A Bonding system
JP2000321326A Contact method of ic socket
JP2000306925A Semiconductor lead frame catching jig
JP2000266809A Device and method for modifying location of ic lead
JP2000223643A Lead frame and method of forming lead frame
JP2000223636A Lead forming die and method of forming lead
JP2000055816A Surface defect inspecting device
JP2000018927A Visual inspection device
JPH11347645A Tie-bar cutting die
JPH11345814A Resin encapsulated die for semiconductor device
JPH11319977A Die for punching lead frame, and lead cutting method
JPH11163242A Lead forming device and method
JPH11140698A Plating apparatus
JPH1197603A Lead cutter