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HEINZE DYCONEX PATENTE

Overview
  • Total Patents
    74
About

HEINZE DYCONEX PATENTE has a total of 74 patent applications. Its first patent ever was published in 1992. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and United States. Its main competitors in its focus markets audio-visual technology, machines and semiconductors are GUL TECHNOLOGIES SINGAPORE LTD, KOREA CIRCUIT CO LTD and ZYCON CORP.

Patent filings per year

Chart showing HEINZE DYCONEX PATENTEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schmidt Walter 64
#2 Martinelli Marco 38
#3 Schmid Hermann 3
#4 Shiyumitsuto Buarutaa 3
#5 Schmidt Walter Dr 3
#6 Losert Ewald 3
#7 Frei Alexandra 3
#8 Meyer Heinrich 3
#9 Roehrs Guenter 3
#10 Barte Hans-Juerg 3

Latest patents

Publication Filing date Title
AU4401601A Method for fabricating electrical connecting elements, and connecting element
AU4220501A Element and method for connecting constituents of an electronic assembly
AU4220401A Method and device for fabricating electrical connecting elements, and connectingelement
AU4220601A Element for an electronic assembly
EP1269804A1 Electrical connecting element and method of fabricating the same
WO0013062A1 Method for producing micro-openings
WO0005765A1 Method for producing rewiring substrates for semiconductor chip packages
EP1002337A1 Semiconductor chip packaging and method for the production thereof
CH692890A5 Structured printed circuit boards and film circuit boards and processes for their preparation.
US6486394B1 Process for producing connecting conductors
WO9718695A1 Process for making multi-layer foil printed circuit boards
WO9700598A1 Connection substrate
EP0740497A1 Electric interconnection substrate
US5698299A Thin laminated microstructure with precisely aligned openings
CA2137861A1 Process for the production of structures
EP0658416A2 Method for texturing polymer foils
EP0658300A1 Structured printed circuit boards and films and process for producing them
US6218628B1 Foil circuit boards and semifinished products and method for the manufacture thereof
WO9526123A1 Method of preparing foil printed circuit boards or semi-finished products for foil printed circuit boards
EP0620702A2 Core for electrical interconnection substrates and electrical interconnection substrates with core, and method for manufacturing the same