| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 5 | |
| #2 | Taiwan | 5 | |
| #3 | Republic of Korea | 2 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Audio-visual technology | |
| #3 | Organic fine chemistry | |
| #4 | Semiconductors | |
| #5 | Materials and metallurgy |
| # | Technology | |
|---|---|---|
| #1 | Electrolytic coating production | |
| #2 | Coating metallic material | |
| #3 | Special acyclic compounds | |
| #4 | Casings and printed circuits | |
| #5 | Layered products | |
| #6 | Alloys | |
| #7 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ito Masahiro | 5 |
| #2 | Asakawa Takanobu | 4 |
| #3 | Adachi Yuichi | 2 |
| #4 | Katakura Koji | 2 |
| #5 | Sasaki Haruko | 2 |
| #6 | Fujinami Tomoyuki | 2 |
| #7 | Kikuchi Rie | 2 |
| #8 | Tsuyuki Junko | 1 |
| #9 | Hayashi Katsunori | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW202033827A | Substituted gold plating solution and substituted gold plating method having a high precipitation rate and a small variation in the film thickness of the precipitated film |