| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Republic of Korea | 4 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 | |
| #3 | China | 2 | |
| #4 | Taiwan | 1 | |
| #5 | United States | 1 |
| # | Technology | |
|---|---|---|
| #1 | Electrolytic coating production | |
| #2 | Coating metallic material | |
| #3 | Layered products | |
| #4 | Casings and printed circuits | |
| #5 | Alloys | |
| #6 | Nanostructures | |
| #7 | Special acyclic compounds | |
| #8 | Nanostructure applications |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ito Masahiro | 4 |
| #2 | Kikuchi Rie | 2 |
| #3 | Asakawa Takanobu | 2 |
| #4 | Katakura Koji | 2 |
| #5 | Sasaki Haruko | 1 |
| #6 | Katsunori Hayashi | 1 |
| #7 | Hayashi Katsunori | 1 |
| #8 | Sakaki Yasuhiko | 1 |
| #9 | Yamanaka Shigeki | 1 |
| #10 | Fujinami Tomoyuki | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20200130787A | Electrolytic Rhodium Plating Solution | |
| CN107034504A | The electroplanting device of chip |