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EBARA UDYLITE KK

Overview
  • Total Patents
    279
About

EBARA UDYLITE KK has a total of 279 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets surface technology and coating, audio-visual technology and chemical engineering are ENTHONE OMI DEUTSCHLAND GMBH, SEMIKA S A and GUANGDONG TONESET SCIENCE & TECH CO LTD.

Patent filings per year

Chart showing EBARA UDYLITE KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kimizuka Ryoichi 27
#2 Tsuji Hidenori 26
#3 Shimizu Satoru 19
#4 Ishikawa Masami 18
#5 Horie Kuniaki 17
#6 Hayashi Shinji 14
#7 Kamitani Masaaki 14
#8 Kobayashi Nobuo 12
#9 Kamiya Masaaki 12
#10 Yoshioka Junichiro 12

Latest patents

Publication Filing date Title
WO2012073816A1 Method for maintaining etching liquid and system therefor
TW201300572A Metal film formation method
WO2011099597A1 Method for producing printed wiring board
JP2012125746A Coating method and method of applying application liquid
JP2012102374A Plating treatment device and plating treatment method
CN102906078A Novel compound and use thereof
WO2011135673A1 Novel compound and use thereof
TW201132254A Printed circuit board manufacturing method
JP2011052309A Method for suppressing growth of microorganism in tank relating to plating process, and system for suppressing growth of microorganism to be used in the same
JP2010159478A Two-layer flexible copper-clad laminate substrate and method for producing the same
JP2010159457A Method of forming metal coating film on plastic base material to be plated
WO2009063788A1 Sputtering apparatus and sputtering film forming method
WO2009063789A1 Method for forming sputtering film on three-dimensional work and apparatus used in the method
JP2010095775A Method for suppressing whisker in copper plating
CN102037063A Method for conditioning insulating resin and its use
JP2009242860A Pretreating agent for acidic copper and plating method using the same
WO2008132926A1 Etching solution, and method for metallization of plastic surface employing the method
JP2009228083A Metal plating method on plastic surface
JP2009167506A Acid copper electroplating solution and method for producing fine wiring circuit using the same
KR20080070509A Method for promoting curing of coating film in pipe