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JAPAN PURE CHEMICAL CO LTD

Overview
  • Total Patents
    62
  • GoodIP Patent Rank
    50,334
  • Filing trend
    ⇩ 93.0%
About

JAPAN PURE CHEMICAL CO LTD has a total of 62 patent applications. It decreased the IP activity by 93.0%. Its first patent ever was published in 2001. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and semiconductors are ENTHONE OMI DEUTSCHLAND GMBH, OM SANGYO CO LTD and OMI INT CORP.

Patent filings per year

Chart showing JAPAN PURE CHEMICAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shimizu Shigeki 29
#2 Shibata Kazuya 28
#3 Kiyohara Yoshizou 18
#4 Takasaki Ryuji 13
#5 Kiyohara Yoshizo 12
#6 Yoshiba Kenji 9
#7 Oohirabaru Yuki 8
#8 Nakagawa Yusuke 8
#9 Okubo Yuya 8
#10 Kogure Yoshinori 7

Latest patents

Publication Filing date Title
JP2019203156A Electrolytic palladium-copper alloy plating solution for forming palladium-copper alloy peeling foil
CN110621806A Electroless platinum plating solution and platinum coating film obtained using same
WO2018097184A1 Electrolytic nickel (alloy) plating solution
JP2019002062A Appearance protectant and metal body treated with the appearance protectant
CN109154093A Electrolytic nickel (alloy) plating liquid
JP2018009227A Electrolytic palladium silver alloy plated film and electrolytic plating liquid for forming the same
JP2017197788A Manufacturing method of electronic component contact member and electronic component contact member
JP2017179516A Appearance protective agent and metal body treated by using the appearance protective agent
WO2016035645A1 Palladium plating solution and palladium coating obtained using same
JP2016211014A Electroless gold plating, aldehyde-amine adduct replenishment liquid, and gold coating using them
JP2016089190A Electroless platinum plating solution and platinum film obtained using the same
JP2015101751A Electrolytic gold plating solution and gold film produced using the same
JP2013224496A Gold sulfite salt aqueous solution for gold plating solution
JP2011168837A Electroless gold plating liquid and gold coated film obtained by using the same
KR20110028312A Catalyst-imparting liquid for palladium plating
KR20110028252A Reduction-type electroless tin plating solution and tin coats formed by using the same
KR20110022576A Electrolytic gold plating solution and gold film obtained using same
WO2009142126A1 Catalyst-imparting liquid for solder plating
WO2008102580A1 Electrolytic gold plating solution and gold film produced by using the same
WO2008081637A1 Reduction-type electroless tin plating solution and tin plating films made by using the same