HITACHI HIGH TECH INSTR CO LTD innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	Japan	850
#2	China	109
#3	Republic of Korea	87
#4	EPO (European Patent Office)	45
#5	United States	39
#6	Taiwan	23
#7	WIPO (World Intellectual Property Organization)	18

#	Technology
#1	Casings and printed circuits
#2	Unspecified technologies
#3	Semiconductor devices
#4	Climate change mitigation in goods production
#5	Control or regulating systems
#6	Unspecified technologies
#7	Digital information transmission
#8	Handling thin material
#9	Data processing systems
#10	Image data processing

Publication	Filing date	Title
JP2015015506A	2014-10-24	Die bonder and die bonding method
JP2014135482A	2013-12-06	Component mounting device
JP2015076410A	2013-10-04	Bonding method and die bonder
JP2015076412A	2013-10-04	Method for detecting posture of rotary shaft of bonding head, die bonder and boding method
JP2015076411A	2013-10-04	Die bonder
JP2015076409A	2013-10-04	Die bonder and adhesive coating method
JP2015070176A	2013-09-30	Component mounting device
JP2015060926A	2013-09-18	Die bonder
JP2015060924A	2013-09-18	Flip chip bonder and bonding method
JP2015060860A	2013-09-17	Dipping mechanism for die bonder and flip-chip bonder
JP2015056595A	2013-09-13	Flip-chip bonder and bonding method
JP2015056594A	2013-09-13	Flip-chip bonder and flip-chip bonding method
JP2015056593A	2013-09-13	Die bonder and method of manufacturing semiconductor
JP2015056596A	2013-09-13	Die bonder and configuration method of die bonder
JP2015056592A	2013-09-13	Die bonder and die bonding method
JP2015053440A	2013-09-09	Die bonder and bonding method
JP2015053441A	2013-09-09	Die bonder and bonding method
JP2015053320A	2013-09-05	Component supply device, and component mounting apparatus using the same
JP2015050227A	2013-08-30	Electronic component supply device and electronic component supply method
JP2015035548A	2013-08-09	Collet and die bonder