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Half-bridge power assembly
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Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module
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Cooling system with a serpentine passage
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DE102019124954A1
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Method for connecting a first electronic component to a second electronic component
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DE102019124953A1
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Process for producing a cohesive connection between a semiconductor and a shaped metal body
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DE102019114040A1
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Three-stage power module
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Semiconductor module
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Semiconductor module
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Semiconductor module
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DE102019111963A1
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Semiconductor module with a semiconductor and with a metal molding, which is electrically contacted by the semiconductor
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DE102019111964A1
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A semiconductor module having a first substrate, a second substrate and a spacer which separates the substrates from one another
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DE102019111367A1
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Power electronics module with improved cooling
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DE102019108932A1
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Semiconductor module and process for its manufacture
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DE102019106394A1
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Method for producing a cohesive connection
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DE102019105465B3
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Pressure sintering device and method for producing an electronic component
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POWER MODULE THAT HAS AN ACTIVE MILLER CLAMP FUNCTION
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DE102018133089A1
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Semiconductor module with a semiconductor and a housing partially housing the semiconductor
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DE102018133090A1
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Arrangement for sintering an electronic assembly
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DK201800991A1
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A heatsink and a method of forming such heatsink
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DE102018221246A1
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Semiconductor power module and method of connecting the same to other electrical components
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