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DANFOSS SILICON POWER GMBH

Overview
  • Total Patents
    290
  • GoodIP Patent Rank
    8,064
  • Filing trend
    ⇩ 27.0%
About

DANFOSS SILICON POWER GMBH has a total of 290 patent applications. It decreased the IP activity by 27.0%. Its first patent ever was published in 2001. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, audio-visual technology and thermal processes are VISWANATHAN LAKSHMINARAYAN, BRIDGE SEMICONDUCTOR CORP and SILICON BASE DEV INC.

Patent filings per year

Chart showing DANFOSS SILICON POWER GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Eisele Ronald 145
#2 Osterwald Frank 101
#3 Rudzki Jacek 69
#4 Becker Martin 57
#5 Paulsen Lars 56
#6 Ulrich Holger 54
#7 Olesen Klaus 38
#8 Olesen Klaus Kristen 33
#9 Kock Mathias 29
#10 Mühlfeld Ole 21

Latest patents

Publication Filing date Title
WO2020254143A1 Half-bridge power assembly
WO2020094411A1 Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module
DE102019127203A1 Cooling system with a serpentine passage
DE102019124954A1 Method for connecting a first electronic component to a second electronic component
DE102019124953A1 Process for producing a cohesive connection between a semiconductor and a shaped metal body
DE102019114040A1 Three-stage power module
DE102019112936A1 Semiconductor module
DE102019112934A1 Semiconductor module
DE102019112935A1 Semiconductor module
DE102019111963A1 Semiconductor module with a semiconductor and with a metal molding, which is electrically contacted by the semiconductor
DE102019111964A1 A semiconductor module having a first substrate, a second substrate and a spacer which separates the substrates from one another
DE102019111367A1 Power electronics module with improved cooling
DE102019108932A1 Semiconductor module and process for its manufacture
DE102019106394A1 Method for producing a cohesive connection
DE102019105465B3 Pressure sintering device and method for producing an electronic component
DE102019200965A1 POWER MODULE THAT HAS AN ACTIVE MILLER CLAMP FUNCTION
DE102018133089A1 Semiconductor module with a semiconductor and a housing partially housing the semiconductor
DE102018133090A1 Arrangement for sintering an electronic assembly
DK201800991A1 A heatsink and a method of forming such heatsink
DE102018221246A1 Semiconductor power module and method of connecting the same to other electrical components