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DALSA SEMICONDUCTOR INC

Overview
  • Total Patents
    70
About

DALSA SEMICONDUCTOR INC has a total of 70 patent applications. Its first patent ever was published in 1993. It filed its patents most often in United States, EPO (European Patent Office) and Germany. Its main competitors in its focus markets micro-structure and nano-technology, semiconductors and optics are MEMSSTAR LTD, SASAGAWA TERUO and XU JINGHUI.

Patent filings per year

Chart showing DALSA SEMICONDUCTOR INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ouellet Luc 51
#2 Antaki Robert 10
#3 Lachance Jonathan 9
#4 Tremblay Yves 6
#5 Blain Stephane 6
#6 Tyler Heather 5
#7 Grondin Manuel 5
#8 Martel Stephane 4
#9 Beaudry Richard 4
#10 Michel Sebastien 3

Latest patents

Publication Filing date Title
US2010173436A1 Method of making BIOMEMS devices
US2009242512A1 Deep reactive ion etching
US2008299695A1 Microchannels for BioMEMS devices
US2009029533A1 Method of controlling film stress in MEMS devices
US2007231943A1 Protection capsule for MEMS devices
EP1745864A2 Method of removing residues formed during the manufacture of MEMS systems
US2007015341A1 Method of making MEMS wafers
US2006211163A1 Anhydrous HF release of process for MEMS devices
US2007065967A1 Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch
US2005142685A1 Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
US2005277304A1 Titanium silicate films with high dielectric constant
US2005250238A1 Method of making electrical connections to hermetically sealed MEMS devices
EP1452481A2 Fabrication of advanced silicon-based MEMS devices
US2005233492A1 Method of fabricating silicon-based MEMS devices
US7138293B2 Wafer level packaging technique for microdevices
EP1302792A2 Method of reducing stress-induced mechanical problems in optical-quality thin films
US6896821B2 Fabrication of MEMS devices with spin-on glass
US6902656B2 Fabrication of microstructures with vacuum-sealed cavity
EP1270762A1 PECVD of optical quality silica films
US6635509B1 Wafer-level MEMS packaging