| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 8 | |
| #2 | China | 2 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | WIPO (World Intellectual Property Organization) | 2 |
| # | Industry | |
|---|---|---|
| #1 | Environmental technology | |
| #2 | Semiconductors | |
| #3 | Machines | |
| #4 | Materials and metallurgy | |
| #5 | Audio-visual technology | |
| #6 | Surface technology and coating |
| # | Name | Total Patents |
|---|---|---|
| #1 | Uzoh Cyprian Emeka | 14 |
| #2 | Nchekwube Emeka | 10 |
| #3 | Caskey Terrence | 2 |
| #4 | Woychik Charles G | 2 |
| #5 | Haba Belgacem | 2 |
| #6 | Damberg Philip | 1 |
| #7 | Desai Kishor V | 1 |
| #8 | Mitchell Craig | 1 |
| #9 | Wei Huailiang | 1 |
| #10 | Sato Hiroaki | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2014027922A1 | Via in substrate with deposited layer | |
| US2013328186A1 | Reduced stress TSV and interposer structures | |
| US2013118784A1 | High strength through-substrate vias | |
| CN103348069A | Method and substrate for material application | |
| US2009280648A1 | Method and apparatus for 3D interconnect |