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CHANGCHUN PETROCHEMICAL CO LTD

Overview
  • Total Patents
    22
  • GoodIP Patent Rank
    184,614
About

CHANGCHUN PETROCHEMICAL CO LTD has a total of 22 patent applications. Its first patent ever was published in 2001. It filed its patents most often in China. Its main competitors in its focus markets macromolecular chemistry and polymers, surface technology and coating and machines are CHANG CHUN PETROCHEMICAL CO LTD, NAN YA PLASTIC CORP and CO TECH DEV CORP.

Patent filings in countries

World map showing CHANGCHUN PETROCHEMICAL CO LTDs patent filings in countries
# Country Total Patents
#1 China 22

Patent filings per year

Chart showing CHANGCHUN PETROCHEMICAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Su Yuhong 4
#2 Fan Yixuan 3
#3 Zhou Ruichang 3
#4 He Mingzheng 3
#5 Lyu Zhisheng 3
#6 Lin Yucai 3
#7 Xiao Guolong 2
#8 Jiang Jinhong 2
#9 Huang Liyong 2
#10 Luo Guonian 2

Latest patents

Publication Filing date Title
CN111058063A Electrolytic copper foil, electrode comprising same, and lithium ion battery comprising same
CN105489472A Precursor cutting protection solution and wafer machining method employing same
CN105441201A Wafer cleaning liquid and method for processing wafer by applying wafer cleaning liquid
CN103788553A Interlayer film for laminated glass and laminated glass containing same
CN103724515A Modified polyvinyl alcohol as emulsifier for preparation of polyvinyl acetate and polyvinyl acetate copolymer and method for preparing polyvinyl acetate and polyvinyl acetate copolymer emulsion
CN107619202A The intermediate coat of laminated glass-use and the laminated glass containing it
CN102234823A Copper material used for producing electrolytic copper foil, and method for producing electrolytic copper foil
CN102134135A Method for recovering and purifying tetra-alkylammonium hydroxide from waste liquor containing tetra-alkylammonium hydroxide
CN1680327A Production of nicotine acid and catalyst therefor
CN1500771A Plasticizer used for polyvinyl butyral
CN1410601A Copper electroplating liquid composition used for copper integrated circuit interconnector
CN1386043A Deposition method for IC copper inner conductive wire inculating crystal layer