HARNDEN ERIC F has a total of 13 patent applications. Its first patent ever was published in 1988. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are KUNSHAN YUANMAO ELECTRONIC TECHNOLOGY CO LTD, NASGLO INT CORP and SCHLOTTER GMBH & CO KG MAX DR.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 5 | |
#2 | WIPO (World Intellectual Property Organization) | 3 | |
#3 | Australia | 2 | |
#4 | EPO (European Patent Office) | 2 | |
#5 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Surface technology and coating | |
#3 | Machines | |
#4 | Packaging and shipping |
# | Name | Total Patents |
---|---|---|
#1 | Okabayashi Kiyoshi | 11 |
#2 | Harnden Eric F | 1 |
#3 | Ito Daryl K | 1 |
#4 | Oakbayashi Kiyoshi | 1 |
Publication | Filing date | Title |
---|---|---|
US5795405A | Machine and method for processing of printed circuit boards by immersion in transversely flowing liquid chemical | |
US5342501A | Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating | |
EP0590046A1 | Basic accelerating solutions for direct electroplating | |
US5268088A | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates | |
US5262042A | Simplified method for direct electroplating of dielectric substrates | |
WO9107526A1 | Method for directly electroplating a dielectric substrate and plated substrate so produced | |
US4933010A | Sensitizing activator composition for chemical plating |