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Stacked half-bridge package with a common conductive clip
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Stacked half-bridge package with a common conductive leadframe
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Stacked half-bridge package with a current carrying layer
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Common drain exposed conductive clip for high power semiconductor packages
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Thermally enhanced semiconductor package with exposed parallel conductive clip
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High power semiconductor package with conductive clips and flip chip driver IC
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Direct contact leadless flip chip package for high current devices
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