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OKI PRINTED CIRCUITS CO LTD

Overview
  • Total Patents
    27
  • GoodIP Patent Rank
    205,696
  • Filing trend
    ⇩ 100.0%
About

OKI PRINTED CIRCUITS CO LTD has a total of 27 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2000. It filed its patents most often in Japan, EPO (European Patent Office) and Singapore. Its main competitors in its focus markets audio-visual technology, computer technology and machines are TECNOMAR OY, FORTIN LAMINATING CORP and GUANGZHOU MEADVILLE ELECTRONICS CO LTD.

Patent filings in countries

World map showing OKI PRINTED CIRCUITS CO LTDs patent filings in countries

Patent filings per year

Chart showing OKI PRINTED CIRCUITS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yagi Takahiro 11
#2 Koike Kiyoshi 10
#3 Iinaga Hiroshi 8
#4 Iinaga Yutaka 7
#5 Mizushina Hideki 6
#6 Fujimaki Noboru 5
#7 Kamiya Jun 4
#8 Shirota Kenichi 3
#9 Haga Satoru 2
#10 Nakazawa Tetsuo 2

Latest patents

Publication Filing date Title
JP2018182012A Multilayer printed wiring board and manufacturing method therefor
JP2017198777A Data generation method
JP2016207776A Multilayer printed wiring board
JP2016076540A Multilayer printed wiring board
JP2015076002A Display method for radar chart and display system for radar chart
JP2015076001A History management method of image data, and history management system of image data
JP2014190717A Strip line resonator
JP2013183082A Multilayer printed board
JP2013069725A Method for manufacturing printed circuit board including element
JP2013058585A Multilayer printed wiring board
JP2012047518A Inspection method for printed circuit board
JP2011129581A Heat dissipation structure for printed wiring board
JP2010212428A Method for designing multilayer printed wiring board and multilayer printed wiring board
JP2009212116A Multilayer printed wiring board
JP2009031907A Rfid tag, rfid system and rfid tag manufacturing method
JP2008277712A Cooling module
JP2008197862A Wiring length calculation system
JP2008186367A Design data sharing system
EP1259102A1 Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same