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BH CO LTD

Overview
  • Total Patents
    23
  • GoodIP Patent Rank
    135,126
  • Filing trend
    ⇧ 100.0%
About

BH CO LTD has a total of 23 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2005. It filed its patents most often in Republic of Korea and Japan. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machine tools are GUANGZHOU MEADVILLE ELECTRONICS CO LTD, LI LONGKAI and SHENZHEN WUZHU TECH CO LTD.

Patent filings in countries

World map showing BH CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 20
#2 Japan 3

Patent filings per year

Chart showing BH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Kyung Hwan 4
#2 Han Yu Sik 4
#3 Kim Jung Yub 4
#4 Kim Jung Yup 4
#5 Kang Dong Weon 3
#6 Lee Hyun Chang 2
#7 Tsujinaka Hiroyuki 2
#8 Park Seo Ul 2
#9 Kim Jae Chang 2
#10 Jeong Dae Won 1

Latest patents

Publication Filing date Title
KR102228677B1 Band saw machine with automatic withdrawal bin
JP2020094051A Patch
KR20200087416A A coverlay of circuit board on which a block division slot is formed
KR102066934B1 Bonding Method Using Polyethylenenaphthalate Flexible Printed Circuit Board and Large Polyethylenenaphthalate Flexible Printed Circuit Board Assembly Manufactured from the Same
JP2019013219A Expandable gree leaf powder
KR20190012997A Double Side Embedded Manufacturing Method
KR20180060695A Manufacturing method for rigid-flexible embedded PCB
JP2018038944A Ozone water shower device
KR101760668B1 Method of manufacturing a capable built-in printed circuit board built-in a number of electronic devices that are configured in different thickness
KR20160127514A A Method of printed circuit board with embedded
KR20160075052A Manufacturing method of a fine pitch thin flexible printed circuit board usingwith aluminum copper foil
KR101596469B1 Automatic slip sheet equipment of hot pressing process for auxiliary material of flexible printed circuit board
KR101478054B1 Sealer supplying device
KR20150057715A Manufacturing method for flexible printed circuit board
KR101425580B1 Tacking method of using carrier film forming coverlay film
KR101373330B1 Manufacturing method for flexible printed circuits board using roll to roll exposure method and through slitting
KR20130129324A Cover ray film adhesion device and multi-layer flexible circuits manufacturing method using the same
KR101189174B1 Manufacturing method for fpcb which using the hole fill method and liquid photosensitive resin
KR101180355B1 Manufacturing method of dual side multi layer typed flexible printed circuit board and dual side multi layer typed flexible printed circuit board manufactured by the method thereof
KR100759452B1 A method for preparing aluminum nitride board having nickel pattern