CELSIA TECHNOLOGIES KOREA INC has a total of 11 patent applications. Its first patent ever was published in 2005. It filed its patents most often in Republic of Korea, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets thermal processes, machines and audio-visual technology are POLAR&CO INC, CHAUN CHOUNG TECH CORP and FURNESS KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 7 | |
#2 | United States | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Thermal processes | |
#2 | Machines | |
#3 | Audio-visual technology | |
#4 | Semiconductors | |
#5 | Computer technology |
# | Name | Total Patents |
---|---|---|
#1 | Choi Jae Joon | 6 |
#2 | Lim Jong Soo | 5 |
#3 | Jang Sung Wook | 4 |
#4 | George A Meyer | 4 |
#5 | Kim Jong Jin | 4 |
#6 | Lee Jeong Hyun | 3 |
#7 | Nam Ki Bu | 3 |
#8 | An Young Kil | 2 |
#9 | Kwack Sung Sik | 2 |
#10 | Meyer George A Iv | 2 |
Publication | Filing date | Title |
---|---|---|
WO2007124028A2 | Support structure for planar cooling devices and methods | |
KR20080070928A | Heat sink and cooler for integrated circuit, and mounting method thereof | |
KR100790790B1 | Heat sink and cooler for integrated circuit | |
KR20080000162A | Flat type heat transfer device and its manufacturing method | |
KR20070103165A | Flat type heat transfer device | |
KR20060129829A | Planar type heat transferring devices using tubes and manufacturing method thereof | |
KR20060099640A | Printed circuit board including heat transfer structure | |
KR20060080653A | Heat transfer device and manufacturing method thereof using hydrophilic wick |