Learn more

CHAUN CHOUNG TECH CORP

Overview
  • Total Patents
    18
  • GoodIP Patent Rank
    101,755
  • Filing trend
    ⇧ 600.0%
About

CHAUN CHOUNG TECH CORP has a total of 18 patent applications. It increased the IP activity by 600.0%. Its first patent ever was published in 2013. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets thermal processes, audio-visual technology and computer technology are DANTHERM COOLING AS, GUANGZHOU HUAZUAN ELECTRONIC TECH CO LTD and J R Thermal LLC.

Patent filings in countries

World map showing CHAUN CHOUNG TECH CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 11
#2 China 4
#3 United States 3

Patent filings per year

Chart showing CHAUN CHOUNG TECH CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Cheng-Tu 4
#2 Liao Pang-Hung 4
#3 Jiang Wen-Hsiung 3
#4 Tseng Kuo-Feng 3
#5 Wang Cheng Tu 2
#6 Wang Shiming 2
#7 Lin I-Yung 2
#8 Chen Chih-Wei 2
#9 Wang Zhengdu 2
#10 Guo Jie-Song 2

Latest patents

Publication Filing date Title
CN111988951A Capillary supporting structure of temperature equalizing plate
TWI695962B Supportable wick structure of a vapor chamber
CN111076581A Edgeless sealing method and structure for vapor chamber
TW202014266A An edgeless sealing method for a vapor chamber and a product thereof are provided. firstly
US2019339019A1 Pressing method of heat conductive base and finished product thereof
TW201942533A Heat conductive sleeve structure
TW201940829A Vapor chamber and manufacturing method thereof
TW201940828A Vapor chamber
US10154613B1 Electronic device and heat dissipation structure thereof
TW201931969A Expansion card module and heat dissipation case thereof
CN107544645A Heat abstractor
TW201800713A Heat dissipation device
TW201725354A Thin? vapor chamber structure
TW201725328A Combined fan and cooling system using the same
TW201712289A Composite structures of plate heat pipe and thermal conduction device thereof
TW201445281A Portable electronic device with exposed heat dissipation structure