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ASYS AUTOMATISIERUNGSSYSTEME GMBH

Overview
  • Total Patents
    46
  • GoodIP Patent Rank
    42,892
  • Filing trend
    ⇩ 66.0%
About

ASYS AUTOMATISIERUNGSSYSTEME GMBH has a total of 46 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2006. It filed its patents most often in Germany, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, packaging and shipping and environmental technology are SHANGHAI YINGSHUO ELECTRONIC TECH CO LTD, COREFLOW LTD and SHANGHAI MICSON IND AUTOMATION CO LTD.

Patent filings per year

Chart showing ASYS AUTOMATISIERUNGSSYSTEME GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Oppelt Klaus 30
#2 Wamsler Florian 23
#3 Arnold Achim 23
#4 Wanka Harald 9
#5 Mang Klaus 5
#6 Kolb Lorenz 5
#7 Lehner Jürgen 4
#8 Drews Matthias 2
#9 Allgaier Peter 2
#10 Vegelahn Torsten 2

Latest patents

Publication Filing date Title
DE102019217033A1 Loading and unloading device for a substrate magazine, substrate magazine system
DE102019216864A1 Magazine system
DE102019211603A1 Substrate magazine, substrate magazine system and substrate assembly system
DE102018219471A1 Transport device for a furnace system, method of operation
DE102018219469A1 Transport system for flat substrates
DE102018207337A1 Transport device for substrates, processing device
DE102018207336A1 Processing device for processing substrates
DE102016214184A1 Transport system and processing system for substrates
DE102016214095A1 Device for gripping and transporting substrates
DE102016214093A1 Device for gripping and transporting substrates
DE102016214094A1 Device for gripping and transporting substrates
DE102015213818A1 Device for handling flat substrates
DE102013202067A1 Method and device for producing a selective emitter structure for a solar cell, solar cell
DE102011115942B3 Apparatus and method for providing film sheets, Appliziervorrichtung for equipping objects with foil sheets
EP2143537A1 Method and device for breaking semiconductor discs or similar substrates
DE102006015142A1 Device for breaking semiconductor wafers