COREFLOW LTD has a total of 15 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2002. It filed its patents most often in United States, EPO (European Patent Office) and United Kingdom. Its main competitors in its focus markets packaging and shipping, semiconductors and machines are SHANGHAI YINGSHUO ELECTRONIC TECH CO LTD, ASYS AUTOMATISIERUNGSSYSTEME GMBH and SHANGHAI MICSON IND AUTOMATION CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 4 | |
#2 | EPO (European Patent Office) | 3 | |
#3 | United Kingdom | 2 | |
#4 | Israel | 2 | |
#5 | WIPO (World Intellectual Property Organization) | 2 | |
#6 | China | 1 | |
#7 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Packaging and shipping | |
#2 | Semiconductors | |
#3 | Machines | |
#4 | Mechanical elements |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Transport or storage devices | |
#3 | Handling thin material | |
#4 | Working stone | |
#5 | Shafts | |
#6 | Manipulators |
# | Name | Total Patents |
---|---|---|
#1 | Richman Hilel | 7 |
#2 | Hamburger Oded | 6 |
#3 | Nishri Boaz | 5 |
#4 | Yassour Yuval | 5 |
#5 | Levavy Shay | 4 |
#6 | Licht Oded Yehoshua | 4 |
#7 | Harnik Arie | 4 |
#8 | Naor Isaac | 4 |
#9 | Soudakovitch Alla | 4 |
#10 | Lautman Ronen | 3 |
Publication | Filing date | Title |
---|---|---|
US9776809B1 | Conveying system with vacuum wheel | |
US2016379863A1 | Wafer gripper with non-contact support platform | |
IL208007D0 | Method and system for locally controlling support of a flat object | |
IL199962D0 | Method and device for separating sliced wafers | |
GB0821358D0 | Method and device for facilitating separation of sliced wafers | |
GB0821357D0 | Method and device for separating sliced wafers |