| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 5 | |
| #2 | United States | 3 | |
| #3 | China | 2 | |
| #4 | Australia | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Packaging and shipping | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Transport or storage devices | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hanaoka Yukihiro | 5 |
| #2 | Suzuki Tetsushi | 5 |
| #3 | Saito Kimikazu | 5 |
| #4 | Shirakawa Kazunori | 1 |
| #5 | Tetsushi Suzuki | 1 |
| #6 | Kimikazu Saito | 1 |
| #7 | Yukihiro Hanaoka | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2009044469A1 | Method of adhering tape and process for manufacturing electronic part | |
| WO2005117098A1 | Tape bonder, tape bonding method, and process for manufacturing electronic component | |
| WO2004028933A1 | Stocker apparatus |