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ASML US INC

Overview
  • Total Patents
    224
  • GoodIP Patent Rank
    235,613
  • Filing trend
    ⇩ 100.0%
About

ASML US INC has a total of 224 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 1996. It filed its patents most often in Taiwan, EPO (European Patent Office) and Japan. Its main competitors in its focus markets semiconductors, surface technology and coating and optics are HIGH END TECH CO LTD, HASEBE KAZUHIDE and BLUE29 CORP.

Patent filings per year

Chart showing ASML US INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Senzaki Yoshihide 30
#2 Lee Sang-In 17
#3 Tsacoyeanes James 13
#4 Herring Robert B 12
#5 Yuh Soon K 11
#6 Oh Hilario L 9
#7 Kurita Samuel 9
#8 Mayer Bruce E 9
#9 Kreuzer Justin L 8
#10 Oskotsky Mark L 8

Latest patents

Publication Filing date Title
CN110678961A Simulation of near field images in optical lithography
TW200424343A Low temperature deposition of silicon based thin films by single-wafer hot-wall rapid thermal chemical vapor deposition
AU2003259950A1 Low termperature deposition of silicon oxides and oxynitrides
TW200408323A Atomic layer deposition of high k metal oxides
TW200408015A Atomic layer deposition of high K metal silicates
AU2003265324A1 Methods of forming interfacial layers for high-k gates by ozone oxidation
TW200411923A In-situ formation of metal insulator metal capacitors
TW200427858A Atomic layer deposition of high k dielectric films
AU2003267995A1 Atomic layer deposition of multi-metallic precursors
AU2003256559A1 Low temperature dielectric deposition using aminosilane and ozone
AU2003245677A1 Method and system for atomic layer removal and atomic layer exchange
TW200500491A Method for energy-assisted atomic layer deposition and removal
TW200416772A System and method for hydrogen-rich selective oxidation
WO03100828A2 Method of depositing an oxide film by chemical vapor deposition
TW200402771A In-situ thermal chamber cleaning
TW200300701A High flow rate bubbler system and method
TW200300460A System and method for improved thin dielectric films
KR20030038396A System and method for preferential chemical vapor deposition
TWI287587B Protective shield and system for gas distribution
TW575904B Optical projection for microlithography