| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 9 | |
| #2 | Australia | 4 | |
| #3 | China | 1 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating | |
| #3 | Machine tools | |
| #4 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Coating metallic material | |
| #3 | Grinding or polishing devices | |
| #4 | Turning | |
| #5 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ivanov Igor C | 15 |
| #2 | Kolics Artur | 12 |
| #3 | Zhang Jonathan Weiguo | 9 |
| #4 | Ting Chiu | 5 |
| #5 | Petrov Nicolai | 3 |
| #6 | Ivanov I C Zhang J W Kolics A | 1 |
| #7 | Zhang Weigho | 1 |
| #8 | Zhang Weiguo | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2005010954A1 | Multi-staged heating system for fabricating microelectronic devices | |
| WO2004114386A2 | Methods and system for processing a microelectronic topography | |
| CN1965105A | Method and device for electroless deposition with temperature-controlled chuck | |
| US6794288B1 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation |