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Closed unit cell array structure capable of reducing region area of non-well region nodes
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Underfilling method for a flip-chip packaging process
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Flash EPROM using junction hot hole injection for erase
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Architecture for dual-chip integrated circuit package and method of manufacturing the same
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Flash memory cell & array with improved pre-program and erase characteristics
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Circuit and method for erasing flash memory array
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Circuit for detecting both charge gain and charge loss properties in a non-volatile memory array
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Variable package structure and process for producing the same
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