AGARWAL RAHUL has a total of 13 patent applications. It increased the IP activity by 50.0%. Its first patent ever was published in 2011. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, it methods for management and measurement are SHEN GENG-SHIN, D3 Semiconductor LLC and ONODERA MASANORI.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | IT methods for management | |
#3 | Measurement | |
#4 | Computer technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Data processing systems | |
#3 | Measuring volume | |
#4 | Electric digital data processing |
# | Name | Total Patents |
---|---|---|
#1 | Agarwal Rahul | 13 |
#2 | Bhagavat Milind S | 6 |
#3 | Goel Vipin | 2 |
#4 | Alapati Ramakanth | 2 |
#5 | Fu Lei | 1 |
#6 | Wilkerson Brett P | 1 |
#7 | Shah Priyal | 1 |
#8 | Cheng Chia-Hao | 1 |
#9 | Greenwood Jon | 1 |
#10 | Setty Kaushik Mysore Srinivasa | 1 |
Publication | Filing date | Title |
---|---|---|
US2020294914A1 | Fan-out packages with warpage resistance | |
US2019371763A1 | Die stacking for multi-tier 3D integration | |
US2019333851A1 | Fan-out package with multi-layer redistribution layer structure | |
US2019326257A1 | High density fan-out packaging | |
US10312221B1 | Stacked dies and dummy components for improved thermal performance | |
US2019164936A1 | 3D stacked dies with disparate interconnect footprints | |
US2016370218A1 | Flat measuring apparatus with plurality of hinges | |
US2014129914A1 | Method of pre-populating editable electronic forms using trusted relationship based id codes | |
US2014070405A1 | Stacked semiconductor devices with a glass window wafer having an engineered coefficient of thermal expansion and methods of making same | |
US2014051233A1 | Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon |