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ADVANCED MICRO FABRICATION EQUIPMENT SHANGHAI INC

Overview
  • Total Patents
    50
About

ADVANCED MICRO FABRICATION EQUIPMENT SHANGHAI INC has a total of 50 patent applications. Its first patent ever was published in 2005. It filed its patents most often in China and Taiwan. Its main competitors in its focus markets electrical machinery and energy, semiconductors and surface technology and coating are ADVANCED MICRO FABRICATION EQUIPMENT INC SHANGHAI, DURALAR TECH LLC and TANGO SYSTEMS INC.

Patent filings in countries

World map showing ADVANCED MICRO FABRICATION EQUIPMENT SHANGHAI INCs patent filings in countries
# Country Total Patents
#1 China 40
#2 Taiwan 10

Patent filings per year

Chart showing ADVANCED MICRO FABRICATION EQUIPMENT SHANGHAI INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tuqiang Ni 17
#2 Jinyuan Chen 6
#3 Zhiyao Yin 6
#4 Seiichi Takayama 4
#5 Wanjun Wu 4
#6 Ni Tu-Qiang 4
#7 Jiang Yong 3
#8 Zhonghao Fan 3
#9 Kevin Pierce 3
#10 Zhiyou Du 3

Latest patents

Publication Filing date Title
TW201316401A Anti-etching layer, semiconductor processing device and its fabrication method
TW201318024A Electromagnetic coupling plasma device capable of improving uniformity and efficiency of plasma
CN102420579A Method and system for automatically realizing radio frequency power matching
CN102352492A Gas injection device with cooling system
CN102347197A Method for dynamically detecting etched end point
CN102355792A Electromagnetic coupling plasma device capable of improving uniformity and efficiency of plasma
CN102395243A Inductance coupling plasma device for improving uniformity and efficiency of plasmon
CN102345112A Semiconductor processing device and gas spray head cooling plate thereof
CN102268656B Sprinkler of metal organic chemical vapor deposition (MOCVD) equipment as well as manufacture method and use method thereof
CN102208333A Plasma etching method
CN102251228A Method for cleaning gas conveying device, and method and reaction device for film growth
CN102117738A Method for rounding vertex angle of silicon wafer by using polymer containing fluorocarbon
CN102403191A Air leakage detecting method for reaction cavity and control method for vacuum reactor
CN102403219A Copper wiring plasma etching method
CN102398887A Deep hole silicon etching method
CN101916738A Electrostatic suction cup structure for easily releasing wafer and method
CN101866826A Fluid conveying device for vacuum processing system
CN101832757A Method for detecting offset position of wafer
CN101866848A Plasma etching method for etching organic matter layer
CN102202454A Switchable radio frequency power source system