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ABM CO LTD

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    63,400
  • Filing trend
    ⇩ 100.0%
About

ABM CO LTD has a total of 29 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2013. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets surface technology and coating, environmental technology and semiconductors are REYNOLDS TECH FABRICATORS INC, COVENTYA S P A and YAMAMOTO MS CO LTD.

Patent filings in countries

World map showing ABM CO LTDs patent filings in countries

Patent filings per year

Chart showing ABM CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ahn Bum Mo 11
#2 Park Seung Ho 8
#3 Joung Che Bong 7
#4 Han Sin Seok 7
#5 Choi Soo Young 4
#6 Lee Chung Sik 4
#7 Kim Byeong Cheol 3
#8 Kim Jong Min 3
#9 Kim Myung Do 3
#10 Kim Jung Hoon 3

Latest patents

Publication Filing date Title
KR102127279B1 Roof system having post for blocking thermal bridge and construction method thereof
KR102144875B1 Roof system having post for blocking thermal bridge and construction method thereof
KR102155576B1 Solar power generation system with expandable connection panel
KR102080509B1 Lifting Floodlight Using Cable Type
KR102094420B1 Floodlight with heat dissipation module using convection
KR20200115904A Solar generation control system and method for controlling solar generation
KR101960728B1 Apparatus of cooling and snow removal in building integrated photovoltaic module
WO2019022273A1 Building-integrated photovoltaic power generation roof
KR101853843B1 Spray system for improving the operating efficiency of the roof type BIPV solar module part that can control the injection nozzle individually
KR20170055431A Metal component and manufacturing method thereof and process chamber having the metal component
KR20170009759A Metal component and process chamber having the same
KR20180007237A Metal component and manufacturing method thereof and process chamber having the metal component
KR20180005035A Upper electrode and process chamber and substrate manufactured by the process chamber
KR20170112338A Metal component and manufacturing method thereof and process chamber having the metal component
CN106340502A Chip substrate with concave part and chip package same
WO2015083991A1 Flexible chip substrate
KR20150137150A Chip substrate comprising a groove portion and chip package using the chip substrate
KR101516371B1 Chip substrate comprising a bonding groove and a sealing member for the chip substrate
KR101467959B1 Led metal substrate
KR101406835B1 jig for plating of LED package substrate