ALUMIPLATE INC has a total of 14 patent applications. Its first patent ever was published in 1990. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Canada. Its main competitors in its focus markets surface technology and coating and packaging and shipping are COVENTYA GMBH, SILVERCROWN LTD and TAIWAN GALVANIZING CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 6 | |
#2 | WIPO (World Intellectual Property Organization) | 4 | |
#3 | Canada | 1 | |
#4 | China | 1 | |
#5 | Hong Kong | 1 | |
#6 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Surface technology and coating | |
#2 | Packaging and shipping |
# | Technology | |
---|---|---|
#1 | Electrolytic coating production | |
#2 | Coating metallic material | |
#3 | Layered products | |
#4 | Transport or storage devices | |
#5 | Metallic material cleaning |
# | Name | Total Patents |
---|---|---|
#1 | Vallejo Gustavo Rolando | 10 |
#2 | Schulz Jon Frederick | 10 |
#3 | Browning Lucy Elizabeth | 10 |
#4 | Carlson William Charles | 10 |
#5 | Fischer Juergen K S | 3 |
#6 | Gehring Johann | 1 |
#7 | Elsel Werner | 1 |
#8 | Nippe Waldemar | 1 |
#9 | Maurer Arnolf | 1 |
#10 | Birkle Siegfried | 1 |
Publication | Filing date | Title |
---|---|---|
US2015376810A1 | Methods for improving adhesion of aluminum films | |
US2016002812A1 | Aluminum films having hardening particles | |
WO02088434A1 | Aluminium electroplating formulations | |
US7250102B2 | Aluminium electroplating formulations |