REYNOLDS TECH FABRICATORS INC has a total of 21 patent applications. Its first patent ever was published in 1995. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets surface technology and coating, semiconductors and machines are SIMFEROPOLSKIJ TS PK T B GLAVS, WUHAN JADECHEM CHEMICALS CO LTD and YAMAMOTO MS CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 9 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | Japan | 5 | |
#4 | Taiwan | 2 |
# | Industry | |
---|---|---|
#1 | Surface technology and coating | |
#2 | Semiconductors | |
#3 | Machines |
# | Technology | |
---|---|---|
#1 | Electrolytic coating production | |
#2 | Coating metallic material | |
#3 | Semiconductor devices | |
#4 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Reynolds H Vincent | 13 |
#2 | Reynolds Harold Vincent | 6 |
#3 | H Vincent Reynolds | 2 |
Publication | Filing date | Title |
---|---|---|
US2002139401A1 | Wet process station with water spray of wafer reverse side | |
US6319386B1 | Submerged array megasonic plating | |
US6221437B1 | Heated workpiece holder for wet plating bath | |
US6106690A | Electroplaner | |
US5932077A | Plating cell with horizontal product load mechanism | |
US5904827A | Plating cell with rotary wiper and megasonic transducer | |
US5865894A | Megasonic plating system | |
US5683564A | Plating cell and plating method with fluid wiper | |
US5597460A | Plating cell having laminar flow sparger |