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XIAN YISIWEI SILICON WAFER TECH CO LTD

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    64,488
About

XIAN YISIWEI SILICON WAFER TECH CO LTD has a total of 25 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China. Its main competitors in its focus markets machine tools, semiconductors and surface technology and coating are INOPLA INC, XIAN YISIWEI SILICON CHIP TECH CO LTD and BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD.

Patent filings in countries

World map showing XIAN YISIWEI SILICON WAFER TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 25

Patent filings per year

Chart showing XIAN YISIWEI SILICON WAFER TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cui Shixun 6
#2 Bai Zongquan 5
#3 Li Yunze 3
#4 Zhang Wanwan 3
#5 Ju Chengmin 3
#6 Miyao Shuichi 3
#7 Jiang Rong 2
#8 Quan Xuanguo 2
#9 Liu Qingchao 2
#10 Wen Yingxi 2

Latest patents

Publication Filing date Title
CN110656370A Crucible pot
CN110303419A A kind of polissoir and method
CN110364463A A kind of silicon wafer processing unit and method
CN110308182A Wafer defect detection method and device
CN110296533A A kind of heating device, cleaning machine and etching machine
CN110181355A A kind of grinding device, grinding method and wafer
CN110310906A A kind of cleaning machine
CN110190015A A kind of wafer cleaning device and method for cleaning wafer
CN110293481A A kind of clean method of milling apparatus and milling apparatus
CN110158154A Constant-current stabilizer and crystal pulling furnace
CN110187061A A kind of processing method of silicon wafer, detection method and processing unit
CN110186994A The processing analysis method and processing unit of heavy metal in a kind of silicon wafer
CN110158155A A kind of processing method and processing unit of silico briquette
CN110153885A A kind of processing method of grinding pad and the processing unit of grinding pad
CN110181391A The temprature control method of lapping liquid feeder, milling apparatus and lapping liquid
CN110085513A A kind of silicon wafer cleaning method and cleaning device
CN110181389A A kind of grinding wafer component and milling apparatus
CN110029394A A kind of crystal pulling furnace and cooling means
CN110153871A Grinding method, the evaluation method of polishing fluid, corresponding intrument and silicon wafer
CN110052962A A kind of polishing pad trimmer, processing unit (plant) and method