Learn more

X CELEPRINT LTD

Overview
  • Total Patents
    178
  • GoodIP Patent Rank
    8,297
  • Filing trend
    ⇩ 27.0%
About

X CELEPRINT LTD has a total of 178 patent applications. It decreased the IP activity by 27.0%. Its first patent ever was published in 2010. It filed its patents most often in United States, Taiwan and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are X-CELEPRINT LTD, MIKUNI ELECTRON CORP and LUXVUE TECH CORP.

Patent filings per year

Chart showing X CELEPRINT LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cok Ronald S 112
#2 Meitl Matthew 106
#3 Bower Christopher 93
#4 Bower Christopher Andrew 39
#5 Prevatte Carl 30
#6 Bonafede Salvatore 27
#7 Gomez David 24
#8 Rotzoll Robert R 24
#9 Raymond Brook 19
#10 Trindade António José Marques 15

Latest patents

Publication Filing date Title
US2021002128A1 Enclosed cavity structures
US2020395316A1 Secure integrated-circuit systems
WO2021037808A2 Variable stiffness modules
US2020339414A1 Overhanging device structures and related methods of manufacture
US2020235059A1 Secure integrated-circuit systems
US2020214141A1 Methods of making printed structures
US2020194370A1 Laser-formed interconnects for redundant devices
US2021043816A1 Structures and methods for electrically connecting printed components
US2019326149A1 Micro-transfer-printable flip-chip structures and methods
US2020176671A1 Cavity structures
US2019229231A1 Device source wafers with patterned dissociation interfaces
US2020176670A1 Printing components to substrate posts
US2020177163A1 Device structures with acoustic wave transducers and connection posts
US2020177149A1 Printing components over substrate post edges
US2020176286A1 Module structures with component on substrate post
US2019157532A1 Interconnection by lateral transfer printing
US10573544B1 Micro-transfer printing with selective component removal
US2020051482A1 Redundant pixel layouts
US2018323178A1 Structures and methods for electrical connection of micro-devices and substrates
US2019348573A1 Flexible devices and methods using laser lift-off